outuo
07-01-25, 16:16
Intel to launch 802.11n Wi-Fi chipset
Wolfgang Gruener (http://www.tomshardware.com/site/submission/feedback.html?site=tgdaily&ed=Wolfgang%20Gruener)
January 17, 2007 15:19
Chicago (IL) - Originally scheduled for Q2 launch, Intel's new Wi-Fi chipset code-named "Kedron" will be unveiled at an event next Tuesday, TG Daily has learned.
Kedron is the wireless (http://www.tgdaily.com/2007/01/17/intel_kedron_802_11/#) component and was intended to be introduced in tandem with the new mobile chipset code-named "Santa Rosa" in Q2 of this year. Kedron will be based on the draft-n wireless standard and promises to increase data transfer bandwidth as well as range of wireless devices.
Kedron has been shipping to vendors for a while (we reported (http://www.tgdaily.com/2006/11/20/intel_kedron_fcc/) about the FCC approval of the chipset back in November of 2006), which suggests that Intel will actually be able to show Kedron in available products next week. Kedron will be officially named "WiFi Link 4965 AGN". There will be a Kedron part without draft-n capability ("WiFi Link 4965 AG") as well.
http://images.tomshardware.com/2006/11/20/kedron.jpg
Intel Kedron
Santa Rosa will succeed Intel's Napa64 platform and bring the ICH8-based mobile 965 chipset, code-named Crestline, with support for FSB800 and the firm's Active Management Technology (AMT). The platform will get four new processors with Merom core, ranging from the Core 2 Duo T7100 (1.8 GHz) to the Core 2 Duo T7700 (2.4 GHz). Pricing for the processor will start at $209 for the T7100 with 2M of L2 cache and reach to $530 for the T7700 with 4 MB L2 cache.
The Santa Rosa announcement will also include Intel's flash cache technology "Robson", which will offer 512 MB or 1 GB of motherboard-integrated NAND flash memory (http://www.tgdaily.com/2007/01/17/intel_kedron_802_11/#).
Related article:
Roadmap update: Core 2 Duo to hit 3 GHz, introduce FSB1333 in Q3 '07 (http://www.tgdaily.com/2006/11/06/intel_roadmap_11_2006/)
Wolfgang Gruener (http://www.tomshardware.com/site/submission/feedback.html?site=tgdaily&ed=Wolfgang%20Gruener)
January 17, 2007 15:19
Chicago (IL) - Originally scheduled for Q2 launch, Intel's new Wi-Fi chipset code-named "Kedron" will be unveiled at an event next Tuesday, TG Daily has learned.
Kedron is the wireless (http://www.tgdaily.com/2007/01/17/intel_kedron_802_11/#) component and was intended to be introduced in tandem with the new mobile chipset code-named "Santa Rosa" in Q2 of this year. Kedron will be based on the draft-n wireless standard and promises to increase data transfer bandwidth as well as range of wireless devices.
Kedron has been shipping to vendors for a while (we reported (http://www.tgdaily.com/2006/11/20/intel_kedron_fcc/) about the FCC approval of the chipset back in November of 2006), which suggests that Intel will actually be able to show Kedron in available products next week. Kedron will be officially named "WiFi Link 4965 AGN". There will be a Kedron part without draft-n capability ("WiFi Link 4965 AG") as well.
http://images.tomshardware.com/2006/11/20/kedron.jpg
Intel Kedron
Santa Rosa will succeed Intel's Napa64 platform and bring the ICH8-based mobile 965 chipset, code-named Crestline, with support for FSB800 and the firm's Active Management Technology (AMT). The platform will get four new processors with Merom core, ranging from the Core 2 Duo T7100 (1.8 GHz) to the Core 2 Duo T7700 (2.4 GHz). Pricing for the processor will start at $209 for the T7100 with 2M of L2 cache and reach to $530 for the T7700 with 4 MB L2 cache.
The Santa Rosa announcement will also include Intel's flash cache technology "Robson", which will offer 512 MB or 1 GB of motherboard-integrated NAND flash memory (http://www.tgdaily.com/2007/01/17/intel_kedron_802_11/#).
Related article:
Roadmap update: Core 2 Duo to hit 3 GHz, introduce FSB1333 in Q3 '07 (http://www.tgdaily.com/2006/11/06/intel_roadmap_11_2006/)